Assembly & Interconnect Technology – sometimes just called “Packaging” – connects the semiconductor chip with the macroscopic environment (system, device). The choice of appropriate package technologies essentially impacts RF- and thermal properties, robustness, interference properties, size and cost and eventually the performance of the device.
This course starts with an overview on mature package platforms and is then separated into two major parts:
- Advanced Packaging for MEMS and Sensors (Horst Theuss)
- Advanced Packaging for Power Semiconductors (Michael Fügl)